iPhone X Restoration - More Than Board Swap
The screen is shattered and the back glass is broken
The mid frame is deformed
Remove the display assembly
The Face ID parts and the rear camera look just fine
The motherboard also looks fine
The battery is severely deformed
Get a new display assembly installed
Connect the battery connector with the DC Power Supply
Power on
The phone turns on normally
The touch screen is unresponsive
Take out the motherboard
We can see there is an obvious gap between the third space PCB and the lower layer
And the lower layer is badly deformed
We need to swap the lower layer
Place the motherboard on the heating platform
Heat for several minutes and then remove the upper layer
Continue to attach the upper layer to the PCB Holder
Remove thermal compound covering CPU
Then heat with the Soldering Iron at 365℃
Clean bonding pads around the edge with Solder Wick
We can see that several pads have come off the board
Among these missing pads, S7, S8 S11 and S12 are important signal pins
We need to treat them by jumping wires
The rests are ground pins and test pins
we can just leave them alone
Apply paste flux to the four missing signal pins
Heat with the pointed-tip Soldering Iron
And solder 0.02 mm Enameled Copper Wire to the four missing pads respectively
Once done, cut off the excess wire with Sculpture Knife
Then loop the wire around the missing pad
Apply some UV Curable Solder Mask
Solidify under the UV Dryer Lamp for 5 minutes
Remember to scrape off excess UV Curable Solder Mask
Make sure the soldered wire is exposed
Attach a known good lower layer to the test fixture
Then the upper layer
Get the display assembly connected
Connect the battery connector with the DC Power Supply
Get the motherboard powered on with tweezers
The phone turns on normally
The touch function is also normal
Judging by this, the touch issue is caused by the lower layer
Since the lower layer is badly deformed
we need to transplant base band CPU, base band EEPROM and the NFC chip
on the original lower layer to a new lower layer
Attach the new lower layer to the PCB Holder
Heat with Hot Air Gun at 280℃ to remove black adhesive around base band CPU
Then heat with Hot Air Gun at 360℃
Detach base band CPU, base band EEPROM and the NFC chip from the new lower layer
Clean the three bonding pads afterwards
Continue to attach the original lower layer to the PCB Holder
Heat with Hot Air Gun to remove base band CPU, base band EEPROM and the NFC chip
Clean residual solder and black adhesive on base band CPU with Soldering Iron
Get base band CPU, base band EEPROM and the NFC chip recalled
Solder the NFC chip, base band EEPROM and base band CPU to the new lower layer
Attach the original upper layer and the new lower layer to the Test Fixture
Get the display assembly connected
Connect the battery connector with the DC Power Supply
Get the motherboard powered on with tweezers
Go to Settings>General>About
Here we can find IMEI serial number and modem firmware
Which indicates that the lower layer swap has been completed successfully
Next thing we do is to solder the two layers together
Attach the new lower layer to the specialized recalling mold
Cover the new lower layer with the matched rebelling stencil
Smear some low-temp Solder Paste on the stencil
Once done, remove the recalling stencil carefully
Continue to place the new lower layer onto the heating platform
With solder paste melting, solder balls start to shape up
Once completed, wait for the lower layer to cool for 10 minutes
Continue to apply BGA Paste Flux to the third space PCB
Get the upper layer in position
Heat for 1 minute on the heating platform at 160℃
With the upper layer sinking and Paste Flux flowing
the two layers have been soldered together successfully
Power off the heating platform
Wait for the double-stacked motherboard to cool for 5 minutes
Get a new back glass assembly
Get the original Face ID parts and rear camera installed
Then get the motherboard installed and flex cables connected
Get a new battery installed
Then get the original earpiece speaker and sensor assembly installed onto the new screen
Connect the original screen with the display extended module
Read data of the original screen with the True Tone repair programmer
Once done, connect the new screen with the display extended module
Write stored data of the original screen to the new screen
Get the new screen connected
Press the power button to turn on the phone
Run function test. All going well
However, the Wi-Fi switch cannot be toggled
We need to unbind Wi-Fi
Connect the iRepair DFU Box to the computer
Then connect the phone with prepare DFU Box
Put the phone into DFU mode
Open the software
Click ‘DFU Model’
Then click ‘Query Info’
Click ‘Unlock Wi-Fi’ to have the Wi-Fi unbound
Once finished, click ‘Exit diagnosis’
Disconnect the phone
The phone turns on automatically
The Wi-Fi switch is back to normal
iPhone X restoration has been completed successfully